台积电 (TSM.US) 2025年第四季度业绩电话会
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会议摘要
TSMC forecasts robust revenue growth driven by AI, with significant investments in technology and global expansion, focusing on profitability, capacity optimization, and manufacturing excellence to sustain long-term success amidst competitive pressures and market dynamics.
会议速览
TSMC held its fourth quarter performance briefing for 2025, with the entire event live-streamed in English for global investors. The meeting outlined the fourth quarter operating conditions, provided a forecast for the first quarter of 2026, and included a Q&A session. It emphasized the forward-looking statements and their uncertainties that may be discussed, reminding participants to refer to the safe harbor statement.
In the fourth quarter of 2025, revenue increased by 5.7% to reach $3.37 billion, exceeding expectations, with a gross profit margin of 62.3%. Advanced technology accounted for 77% of the total, with 3-nanometer technology contributing 28% of the revenue. Looking ahead to the first quarter of 2026, we will continue to maintain strong growth momentum, optimize cost control, and improve profitability.
By 2025, the revenue share of HPC will reach 58%, an increase of 48% compared to the previous year; smartphones will make up 29%, an increase of 11%; IoT will account for 5%, growing by 15%; the automotive business will represent 5%, growing by 34%; and DCE will remain steady at 1%. Throughout the year, HPC, smartphones, IoT, and automotive business all experienced positive growth, while DCE remained stable.
The report summarizes the financial situation of the fourth quarter, including the total amount of cash and market securities, reasons for the increase in liabilities, accounts receivable and inventory days, operating cash flow, capital expenditures and dividend situation, as well as the growth of cash balance at the end of the quarter.
In 2025, the company achieved significant growth in revenue and profit, reaching $122 billion and 66.25 billion New Taiwan Dollars, respectively, with year-on-year increases of 35.9% and 46.4%. Capital expenditures amounted to $40.9 billion, while free cash flow increased by 15.2% to reach 1 trillion New Taiwan Dollars. The company also announced an increase in dividends, with cash dividends per share rising from 14 New Taiwan Dollars to 18 New Taiwan Dollars, with expectations to further increase to at least 23 New Taiwan Dollars in 2026.
The financial overview indicates that first-quarter revenue is expected to be between $34.6 billion and $35.8 billion, up 38% year-on-year, with a gross profit margin of 63%-65%, an operating profit margin of 54%-56%, and an expected effective tax rate of 17%-18%. Strong demand for technology supports business growth, with key information focusing on profit forecasts and market outlook.
In the fourth quarter, the gross profit margin increased by 280 basis points due to cost improvements, currency advantages, and increased capacity utilization, exceeding expectations by 130 basis points. The gross profit margin in the first quarter is expected to increase by 170 basis points to 64%, primarily benefiting from continued cost optimization and increased capacity utilization, but the expansion of overseas factories will dilute the gross profit margin by 2-4%. Overall capacity utilization is expected to increase in 2026, but the overseas factories and the initial introduction of new technologies will each dilute the gross profit margin by 2-4%, and exchange rate fluctuations are also uncertain factors.
TSMC's capital expenditure is expected to reach $49 billion in 2025, and is projected to increase to $52-56 billion in 2026 to address the growing industry demand, and continue to invest in supporting customer development.
In 2026, TSMC plans to allocate 70% to 80% of its capital budget towards advanced process technology, 10% towards special technologies, and 10% to 20% towards advanced packaging, testing, etc. Depreciation expenses are expected to increase significantly, mainly due to the accelerated advancement of 2 nanometer technology. Facing challenges such as rising manufacturing costs, the company commits to achieving a long-term gross margin of over 56% and a high shareholder return rate of over 20% by optimizing capacity utilization, cost control measures, and ensuring sustainable cash dividends.
In the conversation, it was mentioned that TSMC observed strong demand for AI-related products in 2025, with steady performance throughout the year. It is expected that the industry will grow by 14% in 2026, and TSMC's revenue is projected to increase by nearly 30%. Revenue from AI accelerators is high, and demand is growing in multiple fields. TSMC will increase investment to meet customer demand, while optimizing production capacity, with a long-term revenue target of 25% annual growth rate. Global manufacturing layout is based on customer demand and government support.
TSMC shared its capacity expansion plans globally, including in Arizona, Japan, Germany, and Taiwan, as well as progress on advanced processes such as 2 nanometers, N2P, and A16. The company stressed close cooperation with customers to accelerate capacity construction to meet strong demand in areas such as AI, HPC, and smartphones. At the same time, TSMC will continue to invest in advanced packaging technologies to consolidate its technological leadership in the global semiconductor industry.
In the discussion, the management detailed their views on the authenticity of AI demand, emphasizing the need to communicate with customers to confirm the practical applications and benefits of AI in business, including productivity improvements. Despite concerns about an AI bubble, the management, based on in-depth discussions with cloud service providers, believe that AI is gradually integrating into daily life and forming a long-term trend. For the future of the semiconductor industry, the management stated that while they cannot predict specific years, the development momentum of AI is strong, and combined with TSMC's technological leadership and customer trust, they expect the industry to continue to grow.
The conversation revolves around TSMC's expansion plans in the United States, mentioning the acceleration of factory construction in Arizona to meet the demands of customers in the AI field. It is expected that 30% of the future 2-nanometer and more advanced process capacity will be located in the United States. TSMC is working hard to overcome challenges such as approvals, while simultaneously increasing capacity in Taiwan and the United States to meet the strong market demand for AI technology.
Discussed how TSMC evaluates the electrical supply capacity of global data centers to ensure the continued growth of AI infrastructure, while also emphasizing investment plans in advanced packaging technology. It is expected that the relevant revenue will grow rapidly in the next five years, with the proportion increasing to over 10%.
Discussed in the meeting were the non-AI market demand, particularly the impact of rising memory costs on the PC and smartphone markets, as well as the growth potential in the HPC field such as networking and general servers. TSMC stated that despite facing an increase in memory costs, demand for high-end smartphones remains strong, and the company continues to work towards narrowing the supply gap. Regarding the competition in smart wafer foundry, TSMC emphasized the complexity of technology and long design cycles, believing that competitors will find it difficult to surpass them in the short term, and the company is confident in maintaining business growth.
The dialogue discussed whether Taiwan Semiconductor Manufacturing Company (TSMC) should exit the 8-inch and 12-inch wafer business and shift towards advanced packaging. It confirmed a reduction in capacity for some mature nodes, but emphasized that they will continue to support customers. At the same time, addressing concerns about softening consumer demand and rising costs, it pointed out that high-end smartphones and tablets have lower price sensitivity to components and predicted that demand will remain healthy for the next two years.
Discussed TSMC's future AI capacity planning, pointing out that despite current supply chain challenges, it is expected that supply and demand will tend to balance by 2028 through increased productivity and capital expenditure. Emphasized the shortage of engineer resources, especially chip manufacturing engineers, as a key factor constraining capacity expansion. Additionally, mentioned the impact of pricing strategies on profitability, and the importance of maintaining high profits through increasing utilization rates and optimizing capacity allocation.
The financial impact of TSMC's leading technology was discussed, including the long-term high returns of new nodes and the reasons behind them, as well as the strong demand for the 2-nanometer node and the driving force of continuous customer innovation. Emphasis was placed on the market demand driven by low power and high performance technologies, as well as the continuous value brought to customers by TSMC's annual technological improvements.
Discussed were the future five-year capacity expansion of AI chips, capital expenditure planning, and related technological developments, emphasizing the crucial role of TSMC in chip manufacturing and its support strategy for market demand growth.
要点回答
Q:What are the financial highlights for the fourth quarter of 2025 mentioned in the transcript?
A:The financial highlights for the fourth quarter of 2025 include a 5.7% sequential increase in revenue, with revenue in U.S. dollars coming in at $33.7 billion. Gross margin increased by 2.8 percentage points to 62.3%, operating expenses accounted for 8.4% of net revenue, leading to an operating margin of 54%, and the overall fourth quarter EPS was $19.5, with a return on equity (ROE) of 38.8%.
Q:What are the contributions of different technologies and platforms to the fourth quarter and full year 2025 revenue?
A:In the fourth quarter of 2025, three nanometer process technology contributed 28% of wafer revenue, while five and seven nanometer technologies accounted for 35% and 14% respectively, with advanced technologies (seven nanometer and below) making up 77% of wafer revenue. On a full year basis, three nanometer revenue came in at 24%, five nanometer at 36%, and seven nanometer at 14%. Advanced technologies contributed 74% of total revenue, up from 69% in 2024. In terms of platforms, HPC increased 48%, smartphones increased 11%, IoT increased 15%, automotive decreased 1%, and DCE remained flat. HPC accounted for 58% of revenue, smartphones 29%, IoT 5%, automotive 5%, and DCE 1%.
Q:What is the guidance for the first quarter of 2026 provided in the transcript?
A:The guidance for the first quarter of 2026 includes a revenue expectation between $34.6 billion and $35.8 billion, representing a four percent sequential increase or a 38% year-over-year increase at the midpoint, based on an exchange rate assumption of one U.S. dollar to 31.6 t. The expected gross margin is between 63% and 65%, operating margin between 54% and 56%, and the effective tax rate is expected to be between 17% and 18%.
Q:How did the gross margin change from the third quarter to the fourth quarter of 2025, and what factors influenced it?
A:The gross margin increased by 280 basis points sequentially from the third quarter to the fourth quarter of 2025, primarily due to cost improvement efforts, a more favorable foreign exchange rate, and a higher overall capacity utilization rate. The actual gross margin exceeded the high end of the range provided three months ago by 130 basis points, mainly due to better-than-expected cost improvement efforts and an actual fourth quarter exchange rate that was more favorable than the guidance provided.
Q:What is the expected capital budget for 2026 and how will it be allocated?
A:The expected capital budget for 2026 is between $52 billion and $56 billion U.S. dollars, as the company continues to invest to support customers' growth. Approximately 70 to 80% of the 2026 capital budget will be allocated to advanced process technologies, about 10% for specialty technologies, and the remaining 10 to 20% for advanced packaging, testing, mass manufacturing, and other areas.
Q:What is the expected increase in depreciation expense for the coming year and what is the reason behind it?
A:The expected increase in depreciation expense is by a high teens percentage year over year in 2026, mainly due to the ramp-up of two nanometer technologies and investment in future growth.
Q:What are the biggest responsibilities of TSMC in its capital intensive business?
A:The biggest responsibility of TSMC in its capital-intensive business is to support its customers' growth, viewing them as partners, while acknowledging the capital-intensive nature of the business.
Q:What is the trend in TSMC's capital expenditure (capex) and research and development (r and d) investments?
A:TSMC's capex total was $167 billion and R&D investments were $30 billion in the last five years, indicating a significant financial commitment to the business.
Q:What challenges does TSMC face in terms of manufacturing costs and capital requirements?
A:TSMC faces increasing manufacturing cost challenges due to rising costs of leading nodes, expensive tools, and process complexity, resulting in higher capital requirements to build one wafer per month capacity.
Q:What is TSMC's approach to capacity planning and pricing?
A:TSMC's approach to capacity planning involves working closely with customers, maintaining discipline, and ensuring a healthy overall capacity utilization rate through the cycle. TSMC's pricing strategy is strategic, not opportunistic, and they aim to earn a sustainable and healthy return.
Q:How does TSMC plan to maintain profitability while increasing investment in technology and capacity?
A:TSMC plans to maintain profitability by taking actions such as driving cost improvements, generating more wafer output, optimizing capacity, and continuing to invest in technology and capacity to support customer growth while ensuring a sustainable and healthy return.
Q:What is the forecasted growth for the semiconductor industry and TSMC in 2026?
A:The forecasted growth for the semiconductor industry in 2026 is 14 percent year over year, supported by robust AI-related demand. TSMC is confident it can outperform industry growth and expects 2026 to be another strong growth year, with a four-year revenue growth forecast of close to 30 percent in U.S. dollar terms.
Q:How is the demand for AI-related products, and what is TSMC's position regarding this growth?
A:The demand for AI-related products is robust, with AI model adoption across consumer, enterprise, and sovereign segments driving the need for computation. TSMC is a key player in this growth, with revenue from AI accelerators accounting for high teens percent of total revenue and an increasing demand for leading edge silicon.
Q:How is TSMC managing its capacity planning and what are the upcoming capacity expansion plans?
A:TSMC employs a disciplined capacity planning system that assesses market demand from both top-down and bottom-up approaches. They are preparing to increase capacity and accelerate capex investments to support future growth, with ongoing engagement with customers at least two to three years in advance. TSMC is scaling up its capacity in Arizona to meet strong multi-AI related demand.
Q:What is the updated forecast for revenue growth from AI accelerators and overall revenue growth?
A:The updated forecast for revenue growth from AI accelerators is approaching high 50 percent for the five years from 2024 to 2029. TSMC now expects its overall long-term revenue growth to approach 25 percent in U.S. dollar terms for the five years starting from 2024.
Q:What are TSMC's plans for global capacity expansion and their strategic considerations?
A:TSMC's plans for global capacity expansion include speeding up capacity expansion in Arizona, executing well against plans, and putting forward the production schedule due to strong customer demand. They are also leveraging manufacturing excellence to increase productivity. TSMC has made a commitment to further expand their global footprint, continuing to invest in leading edge and advanced packaging facilities in Taiwan, and maintain their position as a reliable technology and capacity provider for the global semiconductor industry.
Q:What are the specific technology nodes and product introductions by TSMC?
A:TSMC's technology nodes include two nanometers, with plans for high volume manufacturing in the second half of 2027, and the introduction of TSMC's first specialty node in 2024. Product introductions include the two nanometer process node, the end to P as an extension of the n2 family, and the sixteen featuring the best-in-class superpower rail (SPR) for specific HPC products.
Q:What concerns are in the financial market regarding AI investments?
A:There is definitely a lot of concern in the financial market about whether we are in a bubble, particularly concerning AI investments.
Q:What feedback is TSMC receiving from customers regarding AI demand and the semiconductor cycle?
A:TSMC is substantially stepping up capital expenditures to support customers and is considering the AI investment carefully, as it amounts to about fifty-two to fifty-six billion U.S. dollars for the K.P.X. The feedback received indicates that AI helps businesses grow successfully, as evidenced by the financial returns shown to TSMC by cloud service providers. These customers are very rich and continue to increase despite the high costs of TSMC's technology.
Q:How does TSMC view the growth and validity of AI?
A:TSMC believes that AI is real and is starting to grow into our daily lives, referring to it as the 'AI mega trend.' The company has also observed productivity improvements with its own AI application, which contributes to TSMC's bottom line.
Q:What are TSMC's views on the semiconductor industry's future and growth potential?
A:TSMC views the semiconductor industry's future as promising, thanks to their fundamental technology leadership, manufacturing excellence, and customer trust. The company projects 25% growth and used to be conservative. They believe in the fundamental positioning of TSMC to be a very good future growth opportunity.
Q:How does TSMC plan for U.S. expansion and what are the expectations regarding the construction of more fabs in Arizona?
A:TSMC plans to expand in the U.S., particularly in Arizona, to meet the demand from AI customers. They intend to build more fabs, aiming for around 30% of their two-nanometer and more advanced capacity in Arizona once they complete scaling out to a certain capacity. They are working hard to expedite this expansion due to strong demand and are also increasing capacity in Taiwan. The timeline for reaching 30% or even 20% capacity is pending meeting all permit requirements and government support. TSMC has acquired additional land in Arizona to expand manufacturing capacity, which will help improve productivity and serve U.S. customers better.
Q:How does TSMC assess the potential power electricity supply for data centers and the related factors?
A:TSMC is concerned about electricity availability in Taiwan and seeks sufficient power to expand without limitations. For AI data centers, the company has discussed with customers the importance of the overall infrastructure, including power grid availability. TSMC has worked on this in advance, as their customers are aware that power supply planning is critical. The customers have been focusing on this for five to six years, which has led them to consider TSMC as the bottleneck rather than power supply issues. TSMC is looking at power supply worldwide, including alternative power sources, and assessing the supply of cooling systems and other related infrastructure to ensure no constraints in the future.
Q:What are the plans for the expansion of the packaging business?
A:The expansion plans include a focus on both existing advanced packaging techniques such as FADIC and developing more advanced packaging solutions like panel-based methods in the long term. There will also be a continued focus on advanced packaging, with an emphasis on areas where customers have a need, including investments in areas such as memory and mass production.
Q:What was the revenue contribution of advanced packaging in the last year and what is the expectation for this year?
A:The revenue contribution from advanced packaging in the last year was about 8%, with an expectation of slightly over 10% for this year.
Q:What was the revenue contribution of backend packaging (beyond active testing) in 2025 and what is the focus of the capex this year?
A:The revenue contribution of backend packaging in 2025 was not specified in the transcript, but it is implied to have contributed to the overall advanced packaging revenue. The focus of the capex this year is guided to be between 10 to 20 percent, the same as the previous year.
Q:What is the impact of rising memory costs on PC and smartphone markets, and how is it affecting other segments like networking and general servers?
A:The impact of rising memory costs on PC and smartphone markets is expected to result in lower unit growth for PCs and smartphones due to higher surprise. However, the demand for TSMC is not expected to change significantly, as customers are not altering their behavior, and the company continues to supply a high proportion of high-end smartphones. The demand for networking and general servers is also expected to grow strongly, supported by the need for AI data scaling within networking switches and similar equipment.
Q:Is there a risk of market share loss for TSMC due to competition from U.S. companies and their foundries?
A:There is no significant risk of market share loss for TSMC due to competition from U.S. companies and their foundries. TSMC views their competitors as formidable but remains confident in its ability to maintain business growth. The technology is complicated, and it takes two to three years to fully utilize it, followed by another one to two years to ramp up once the product is approved. TSMC has a history of competition with U.S. companies and is confident in its strategies to sustain its business growth.
Q:What is TSMC's strategy concerning the capacity shift from mature nodes to advanced packaging?
A:TSMC's strategy concerning the capacity shift is to reduce capacity in eight-inch and ten-inch wafers while ensuring customer support. The company is working with customers to reallocate resources more flexibly and optimize support for them. TSMC assures customers that they will continue to be supported in the eight-inch wafers of their business.
Q:How is the increase in memory prices affecting the demand for consumer electronics and what is TSMC's view on this impact?
A:The increase in memory prices is leading to concerns about further demand softness in consumer electronics in the current year and the next. TSMC's view is that most of their customers focus on higher-end smartphones or PCs, which are less sensitive to the components' price increase. Consequently, they continue to have a healthy forecast for the current year and the end of the next year.
Q:What is TSMC's position on the supply and demand balance in the next few years, and how is the capex investment supporting this?
A:TSMC believes there will be continued supply challenges through 2026 due to the significant step-up in capex to support customers at fifty-two to fifty-six billion. The expectation is for the supply and demand gap to be more balanced in 2027. TSMC is also facing challenges in developing a sufficient number of engineering talents, both in the U.S. and Taiwan, to expand their operations.
Q:What is the projected timeline for TSMC to start increasing its output and how does this relate to productivity improvements?
A:TSMC expects to start increasing its output significantly in 2028 and 2029, corresponding with the time when the gap between supply and demand is expected to narrow. The focus on the short term is on improving productivity, with substantial results already achieved due to weather conditions in 2026 and 2027.
Q:What is the purpose of TSMC's incentive program for its people, and what is the primary focus for the next few years?
A:The purpose of TSMC's incentive program is to satisfy customers and make customers feel that TSMC is trustworthy and supportive of their growth opportunities. The primary focus for the next few years is on improving productivity, particularly in 2026 and 2027.
Q:How does TSMC expect the AI demand mega-trend to affect its capital expenditure (CAPEX)?
A:TSMC expects the AI demand mega-trend to significantly increase its capital expenditure (CAPEX), with a step up in investment in 2027, and a continued focus on productivity improvement. The company has guided for the AI segment to grow in the mid to high fifties in the five-year period from 2024 to 2029, and while the exact amount for 2027 is not disclosed, it is anticipated to be significantly higher than the previous three years.
Q:What are the factors influencing profitability for TSMC, and how does pricing play into this?
A:Profitability for TSMC is influenced by six factors, with price being just one of them. TSMC aims to 'earn our value,' and while pricing benefits have helped cover inflation costs in recent years, they are not the sole driver of profitability. Other factors include high utilization rates, manufacturing excellence, increasing productivity, and optimizing capacity among nodes.
Q:How does the technology differentiation of TSMC impact its revenue over time?
A:TSMC's technology differentiation, which includes high-speed performance and low power consumption, has allowed the company to maintain high revenue even in the fourth or fifth year of a new node. This technology leadership enables continuous customer innovation and ensures that demand remains strong, supporting sustained revenue growth.
Q:What is TSMC's outlook on the revenue contribution from the 2nm node in 2026 and the potential for process migration?
A:TSMC expects a very strong customer interest and demand for the 2nm node in 2026, with a fast ramp anticipated. The company is guiding for significant revenue contribution from 2nm in 2026. Process migration to 2nm is expected to be beneficial for customers due to the technology's ability to provide lower power consumption and high speed performance. There is a focus on managing the supply gap, but the demand is expected to be strong.
Q:What is the anticipated revenue contribution from the 2nm node in 2026, and how does cost per transistor affect customer decisions?
A:The anticipated revenue contribution from the 2nm node in 2026 is expected to be substantial. Cost per transistor is a concern but TSMC's technology can provide value due to the ability to deliver lower power consumption and high speed performance. The cost per transistor may increase, but the overall performance comparison is much better, encouraging customers to stay with TSMC. The main bottleneck for TSMC is currently the wafer supply rather than power consumption.
Q:What is TSMC's strategy for dealing with the capacity gap and the expectations for future revenue growth?
A:TSMC's strategy for dealing with the capacity gap includes continuing to invest heavily in capital expenditure to increase capacity and improve productivity. The company expects significant revenue growth in the coming years, supported by strong demand for semiconductors and the transition to more advanced nodes like the 2nm node. Despite the challenges, TSMC is optimistic about the future, maintaining a focus on technology leadership and customer satisfaction.






